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CVE-2026-21369— Out-of-bounds Write in Camera Driver

Quick assessment

Affected
Qualcomm, Inc. Snapdragon
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Chipsets是美国Qualcomm公司的一系列芯片组。 Qualcomm Chipsets存在缓冲区错误漏洞，该漏洞源于在用户空间修改后使用过时的LED计数值处理flash命令时导致内存破坏。以下版本受到影响：FastConnect 6200、FastConnect 6700、FastConnect 6900、FastConnect 7800、G1 Gen 1、G3x Gen 2、IQ9 Series Platform、Kalpeni、LeMans_AU_LGIT、LeMansAU、

CVSS 5.3 · Medium EPSS 0.08% · P0

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution

Affected Version Matrix 109

VendorProduct Version RangeStatus
Qualcomm, Inc. Snapdragon FastConnect 6200 affected
FastConnect 6700 affected
FastConnect 6900 affected
FastConnect 7800 affected
G1 Gen 1 affected
G3x Gen 2 affected
IQ9 Series Platform affected
Kalpeni affected
… +101 more rows
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I. Basic Information for CVE-2026-21369

Vulnerability Information
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Vulnerability Title
Out-of-bounds Write in Camera Driver
Source: CVE Program / CVE List V5
Vulnerability Description
Memory Corruption when handling flash commands due to outdated LED count values being used after userspace modification.
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:H/PR:L/UI:N/S:C/C:L/I:L/A:L
Source: CVE Program / CVE List V5
Vulnerability Type
跨界内存写
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm Chipsets 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国Qualcomm公司的一系列芯片组。 Qualcomm Chipsets存在缓冲区错误漏洞，该漏洞源于在用户空间修改后使用过时的LED计数值处理flash命令时导致内存破坏。以下版本受到影响：FastConnect 6200、FastConnect 6700、FastConnect 6900、FastConnect 7800、G1 Gen 1、G3x Gen 2、IQ9 Series Platform、Kalpeni、LeMans_AU_LGIT、LeMansAU、
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon FastConnect 6200 -

II. Public POCs for CVE-2026-21369

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III. Intelligence Information for CVE-2026-21369

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Vendor Advisories for CVE-2026-21369 (1)

Same Patch Batch · Qualcomm, Inc. · 2026-07-06 · 11 CVEs total

CVE-2026-25268 8.8 HIGH Stack-based Buffer Overflow in WLAN Host
CVE-2026-25271 7.8 HIGH Time-of-check Time-of-use (TOCTOU) Race Condition in DSP Service
CVE-2026-21379 7.8 HIGH Buffer Over-read in Windows Compute
CVE-2026-21383 7.1 HIGH Reusing a Nonce, Key Pair in Encryption in HLOS
CVE-2025-59617 6.6 MEDIUM Use After Free in Computer Vision
CVE-2025-59616 6.6 MEDIUM Use After Free in Computer Vision
CVE-2025-59615 6.6 MEDIUM Use After Free in Computer Vision
CVE-2026-21384 5.3 MEDIUM Out-of-bounds Write in Camera Driver
CVE-2026-21370 5.3 MEDIUM Out-of-bounds Write in Camera Driver
CVE-2026-21368 5.3 MEDIUM Out-of-bounds Write in Camera Driver

IV. Related Vulnerabilities

Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-787