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I. Basic Information for CVE-2017-18172
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
In a device, with screen size 1440x2560, the check of contiguous buffer will overflow on certain buffer size resulting in an Integer Overflow or Wraparound in System UI in Snapdragon Automobile, Snapdragon Mobile in version MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品System UI 数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9635M等都是美国高通（Qualcomm）公司的应用于不同平台的中央处理器（CPU）产品。System UI是其中的一个系统UI（用户界面）组件。 多款Qualcomm Snapdragon产品中的System UI存在整数溢出漏洞。本地攻击者可利用该漏洞执行未授权的操作。以下产品（用于汽车和移动设备）受到影响：Qualcomm MDM9635M；SD 400；SD 410/12；SD 425；SD 427；SD 430；SD 435；SD 450；SD 615/16；SD 41
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile MDM9635M, SD 400, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SDM630, SDM636, SDM660, Snapdragon_High_Med_2016 -
II. Public POCs for CVE-2017-18172
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III. Intelligence Information for CVE-2017-18172
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IV. Related Vulnerabilities
Same product: Snapdragon Automobile, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2017-18172

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