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I. Basic Information for CVE-2017-18278
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
An integer underflow may occur due to lack of check when received data length from font_mgr_qsee_request_service is bigger than the minimal value of the segment header, which may result in a buffer overflow, in Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear in MDM9206, MDM9607, MDM9650, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通(Qualcomm)公司的一款中央处理器(CPU)产品。 多款Qualcomm产品中的qsee_hash存在安全漏洞。攻击者可利用该漏洞执行未授权的操作。以下产品及版本(用于汽车、移动和可穿戴设备)受到影响:MDM9206;MDM9607;MDM9650;SD 210;SD 212;SD 205;SD 425;SD 430;SD 450;SD 625;SD 650/52;SD 820;SD 820A;SD 835;SD 845;SD 850。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm Technologies, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206 -
II. Public POCs for CVE-2017-18278
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III. Intelligence Information for CVE-2017-18278
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IV. Related Vulnerabilities
V. Comments for CVE-2017-18278

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