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CVE-2017-18324

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm产品中的GERAN存在信息泄露漏洞。攻击者可利用该漏洞泄露GERAN调试消息中的加密密钥材料。以下产品（用于移动及可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9615；MDM9625；MDM9635M；MDM9645；MDM9650；MDM9655；MSM8909W；SD 210；SD 212；SD 205；SD 410/12；SD 425

AI Predicted 7.5 Difficulty: Trivial EPSS 0.21% · P11

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2017-18324

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Cryptographic key material leaked in debug messages - GERAN in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High_Med_2016.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品信息泄露漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm产品中的GERAN存在信息泄露漏洞。攻击者可利用该漏洞泄露GERAN调试消息中的加密密钥材料。以下产品（用于移动及可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9615；MDM9625；MDM9635M；MDM9645；MDM9650；MDM9655；MSM8909W；SD 210；SD 212；SD 205；SD 410/12；SD 425
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9625, MDM9635M, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 835, SD 855, SDX24, Snapdragon_High -

II. Public POCs for CVE-2017-18324

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III. Intelligence Information for CVE-2017-18324

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Vendor Advisories for CVE-2017-18324 (1)

Other References for CVE-2017-18324 (1)

Same Patch Batch · Qualcomm, Inc. · 2019-01-03 · 13 CVEs total

CVE-2017-11004 多款Qualcomm产品信息泄露漏洞
CVE-2017-18141 多款Qualcomm产品TrustZone 访问控制错误漏洞
CVE-2017-18319 多款Qualcomm产品Modem 安全漏洞
CVE-2017-18320 多款Qualcomm产品输入验证漏洞
CVE-2017-18321 多款Qualcomm产品信息泄露漏洞
CVE-2017-18322 多款Qualcomm产品信息泄露漏洞
CVE-2017-18323 多款Qualcomm产品Modem 安全漏洞
CVE-2017-18326 多款Qualcomm产品Modem 安全漏洞
CVE-2017-18327 多款Qualcomm产品HLOS 加密问题漏洞
CVE-2017-18328 多款Qualcomm产品安全漏洞
CVE-2017-18329 多款Qualcomm产品缓冲区错误漏洞
CVE-2017-18330 多款Qualcomm产品Crypto 缓冲区错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Mobile, Snapdragon Wear
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2017-18324

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