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CVE-2017-18328

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款Qualcomm产品中的UTILS中存在资料不足漏洞。攻击者可利用该漏洞执行未授权的操作。以下产品（用于移动设备和可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9635M；MDM9640；MDM9645；MDM9650；MDM9655；MSM8909W；SD 210；SD 212；SD 205；SD 425；SD

AI Predicted 7.8 Difficulty: Hard EPSS 0.22% · P12

Possible ATT&CK Techniques 1 AI

T1210.004
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I. Basic Information for CVE-2017-18328

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Use after free in QSH client rule processing in snapdragon mobile and snapdragon wear in versions MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款Qualcomm产品中的UTILS中存在资料不足漏洞。攻击者可利用该漏洞执行未授权的操作。以下产品（用于移动设备和可穿戴设备）受到影响：Qualcomm MDM9206；MDM9607；MDM9635M；MDM9640；MDM9645；MDM9650；MDM9655；MSM8909W；SD 210；SD 212；SD 205；SD 425；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9650, MDM9655, MSM8909W, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 636, SD 820, SD 835, SDA660, SDM630, SDM660, Snapdragon_High_Med_2016 -

II. Public POCs for CVE-2017-18328

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III. Intelligence Information for CVE-2017-18328

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Vendor Advisories for CVE-2017-18328 (1)

Other References for CVE-2017-18328 (1)

Same Patch Batch · Qualcomm, Inc. · 2019-01-03 · 13 CVEs total

CVE-2017-11004 多款Qualcomm产品信息泄露漏洞
CVE-2017-18141 多款Qualcomm产品TrustZone 访问控制错误漏洞
CVE-2017-18319 多款Qualcomm产品Modem 安全漏洞
CVE-2017-18320 多款Qualcomm产品输入验证漏洞
CVE-2017-18321 多款Qualcomm产品信息泄露漏洞
CVE-2017-18322 多款Qualcomm产品信息泄露漏洞
CVE-2017-18323 多款Qualcomm产品Modem 安全漏洞
CVE-2017-18324 多款Qualcomm产品信息泄露漏洞
CVE-2017-18326 多款Qualcomm产品Modem 安全漏洞
CVE-2017-18327 多款Qualcomm产品HLOS 加密问题漏洞
CVE-2017-18329 多款Qualcomm产品缓冲区错误漏洞
CVE-2017-18330 多款Qualcomm产品Crypto 缓冲区错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Mobile, Snapdragon Wear
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2017-18328

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