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I. Basic Information for CVE-2018-11821
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible integer overflow may happen in WLAN during memory allocation in Snapdragon Mobile, Snapdragon Wear in version IPQ8074, MDM9206, MDM9607, MDM9650, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品数字错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm IPQ8074等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的WLAN存在整数溢出漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于移动和可穿戴设备）受到影响：Qualcomm IPQ8074；MDM9206；MDM9607；MDM9650；SD 425；SD 427；SD 430；SD 435；SD 450；SD 625；SD 650/52；SD 835；SD 845；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile, Snapdragon Wear IPQ8074, MDM9206, MDM9607, MDM9650, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 835, SD 845, SD 850, SDA660, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016 -
II. Public POCs for CVE-2018-11821
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III. Intelligence Information for CVE-2018-11821
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New Vulnerabilities
Product: Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11821

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