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I. Basic Information for CVE-2021-1957
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper Access Control when ACL link encryption is failed and ACL link is not disconnected during reconnection with paired device in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞,该漏洞源于蓝牙中存在不正确访问控制。当 ACL 链接加密失败且 ACL 链接在与配对设备重新连接期间未断开连接时,访问控制不当。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music APQ8017, QCA6174A, QCA6390, QCA6391, QCA6421, QCA6426, QCA6431, QCA6436, QCA6574AU, QCA6696, QCM6125, QCS610, QCS6125, QRB5165, Qualcomm215, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD855, SD865 5G, SD870, SDX55, SDX55M, SDXR2 5G, WC -
II. Public POCs for CVE-2021-1957
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III. Intelligence Information for CVE-2021-1957
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IV. Related Vulnerabilities
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