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I. Basic Information for CVE-2021-1960
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper handling of ASB-C broadcast packets with crafted opcode in LMP can lead to uncontrolled resource consumption in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:A/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 芯片中存在输入验证错误漏洞,该漏洞源于产品未对输入数据做有效验证。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer Electronics Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking AQT1000, AR8031, AR8035, CSRA6620, CSRA6640, CSRB31024, IPQ5010, IPQ5018, IPQ5028, QCA1062, QCA1064, QCA2062, QCA2064, QCA2065, QCA2066, QCA6175A, QCA6310, QCA6335, QCA6390, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564A, QCA6564A -
II. Public POCs for CVE-2021-1960
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III. Intelligence Information for CVE-2021-1960
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