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I. Basic Information for CVE-2021-1962
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Buffer Overflow while processing IOCTL for getting peripheral endpoint information there is no proper validation for input maximum endpoint pair and its size in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在安全漏洞，该漏洞源于没有对输入最大端点对及其大小进行适当的验证。攻击者可利用该漏洞在处理 IOCTL 以获取外围端点信息时造成缓冲区溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking AQT1000, AR9380, FSM10055, FSM10056, IPQ8064, IPQ8065, IPQ8068, IPQ8069, MDM9150, QCA6391, QCA6420, QCA6430, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA9531, QCA9558, QCA9561, QCA9563, QCA9880, QCA9882, QCA9886, QCA9887, QCA9 -
II. Public POCs for CVE-2021-1962
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III. Intelligence Information for CVE-2021-1962
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IV. Related Vulnerabilities
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-1962

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