CVE-2021-30276
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 产品存在安全漏洞，该漏洞源于动态执行 XPU 重新配置时不正确的访问控制可能导致对安全资源的未授权访问。
Possible ATT&CK Techniques 1 AI
T1068 · Exploitation for Privilege Escalation
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I. Basic Information for CVE-2021-30276
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Improper access control while doing XPU re-configuration dynamically can lead to unauthorized access to a secure resource in Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wired Infrastructure and Networking
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 产品存在安全漏洞，该漏洞源于动态执行 XPU 重新配置时不正确的访问控制可能导致对安全资源的未授权访问。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Wired Infrastructure and Networking | AR8035, QCA6390, QCA6391, QCA6426, QCA6436, QCA8337, QCA9984, QCM2290, QCM4290, QCM6490, QCS2290, QCS405, QCS4290, QCS6490, QCX315, QRB5165, QRB5165N, QSM8250, SD460, SD480, SD660, SD662, SD690 5G, SD750G, SD765, SD765G, SD768G, SD778G, SD865 5G, SD870, S | - |
|
II. Public POCs for CVE-2021-30276
| # | POC Description | Source Link | Shenlong Link |
|---|
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Same Patch Batch · Qualcomm, Inc. · 2022-01-03 · 28 CVEs total
| CVE-2021-30351 | 9.8 CRITICAL | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-30275 | 9.3 CRITICAL | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-30262 | 8.4 HIGH | Qualcomm Chipsets 资源管理错误漏洞 |
| CVE-2021-30335 | 8.4 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30336 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30282 | 8.4 HIGH | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2021-30274 | 8.4 HIGH | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2021-30337 | 8.4 HIGH | Qualcomm 芯片资源管理错误漏洞 |
| CVE-2021-30303 | 7.8 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30267 | 7.8 HIGH | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-30268 | 7.8 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30289 | 7.8 HIGH | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2021-30279 | 7.8 HIGH | Qualcomm SDX55和QCA6390 访问控制错误漏洞 |
| CVE-2021-30273 | 7.5 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30293 | 7.5 HIGH | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-30272 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30271 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30270 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30269 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2020-11263 | 7.3 HIGH | Qualcomm SDX55和QCA6390 输入验证错误漏洞 |
Showing top 20 of 28 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
V. Comments for CVE-2021-30276
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