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CVE-2021-30278

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款 Qulcomm 产品中存在输入验证错误漏洞，该漏洞源于产品的TrustZone内存转移接接口未对输入数据做有效验证。攻击者可通过该漏洞导致信息泄露。

CVSS 7.1 · High EPSS 0.14% · P4
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I. Basic Information for CVE-2021-30278

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Improper input validation in TrustZone memory transfer interface can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:C/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 多款 Qulcomm 产品中存在输入验证错误漏洞，该漏洞源于产品的TrustZone内存转移接接口未对输入数据做有效验证。攻击者可通过该漏洞导致信息泄露。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking AR8031, AR8035, CSR8811, CSRA6620, CSRA6640, CSRB31024, FSM10055, FSM10056, IPQ6000, IPQ6005, IPQ6010, IPQ6018, IPQ6028, MDM9150, MDM9205, QCA4004, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, Q -

II. Public POCs for CVE-2021-30278

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III. Intelligence Information for CVE-2021-30278

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Same Patch Batch · Qualcomm, Inc. · 2022-01-03 · 28 CVEs total

CVE-2021-30351 9.8 CRITICAL Qualcomm 芯片信息泄露漏洞
CVE-2021-30276 9.3 CRITICAL Qualcomm 芯片安全漏洞
CVE-2021-30275 9.3 CRITICAL 多款Qualcomm产品输入验证错误漏洞
CVE-2021-30274 8.4 HIGH Qualcomm 芯片输入验证错误漏洞
CVE-2021-30335 8.4 HIGH Qualcomm 芯片安全漏洞
CVE-2021-30336 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-30337 8.4 HIGH Qualcomm 芯片资源管理错误漏洞
CVE-2021-30282 8.4 HIGH Qualcomm 芯片输入验证错误漏洞
CVE-2021-30262 8.4 HIGH Qualcomm Chipsets 资源管理错误漏洞
CVE-2021-30279 7.8 HIGH Qualcomm SDX55和QCA6390 访问控制错误漏洞
CVE-2021-30268 7.8 HIGH Qualcomm 芯片安全漏洞
CVE-2021-30267 7.8 HIGH 多款Qualcomm产品输入验证错误漏洞
CVE-2021-30289 7.8 HIGH 多款Qualcomm产品缓冲区错误漏洞
CVE-2021-30303 7.8 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-30273 7.5 HIGH Qualcomm 芯片安全漏洞
CVE-2021-30293 7.5 HIGH Qualcomm 芯片信息泄露漏洞
CVE-2021-30271 7.3 HIGH Qualcomm 芯片代码问题漏洞
CVE-2021-30272 7.3 HIGH Qualcomm 芯片代码问题漏洞
CVE-2021-30270 7.3 HIGH Qualcomm 芯片代码问题漏洞
CVE-2021-30269 7.3 HIGH Qualcomm 芯片代码问题漏洞

Showing top 20 of 28 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Voice & Music, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-30278

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