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I. Basic Information for CVE-2021-30298
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible out of bound access due to improper validation of item size and DIAG memory pools data while switching between USB and PCIE interface in Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 芯片缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞,该漏洞源于在 USB 和 PCIE 接口之间切换时,可能由于项目大小和 DIAG 内存池数据验证不当而导致越界访问。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking AR8031, AR8035, CSRA6620, CSRA6640, FSM10055, FSM10056, IPQ8072A, IPQ8074A, IPQ8076A, MDM9150, QCA6390, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8337, QCN9000, QCN9074, QCS405, QCS410, QCS610, QRB5165, QRB5165N, Qualcomm215, SA8155P, SD205, SD210, SD460 -
II. Public POCs for CVE-2021-30298
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III. Intelligence Information for CVE-2021-30298
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IV. Related Vulnerabilities
V. Comments for CVE-2021-30298

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