CVE-2021-30314
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在信息泄露漏洞，该漏洞源于访问服务的第三方应用程序缺少验证可能会导致信息。
Possible ATT&CK Techniques 1 AI
T1530 · Data from Cloud Storage
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I. Basic Information for CVE-2021-30314
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Lack of validation for third party application accessing the service can lead to information disclosure in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:N/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品信息泄露漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在信息泄露漏洞，该漏洞源于访问服务的第三方应用程序缺少验证可能会导致信息。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables | QCA6390, QCA6391, QCA6426, QCA6436, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS603, QCS605, QCS610, QCS6490, Qualcomm215, SA6145P, SA6150P, SA6155, SA6155P, SA8145P, SA8150P, SA8155, SA8155P, SD 8 Gen | - |
|
II. Public POCs for CVE-2021-30314
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2021-30314 (1)
Same Patch Batch · Qualcomm, Inc. · 2022-01-13 · 12 CVEs total
| CVE-2021-30285 | 9.3 CRITICAL | Qualcomm 组件 输入验证错误漏洞 |
| CVE-2021-30308 | 7.8 HIGH | Google Android 安全漏洞 |
| CVE-2021-30311 | 7.8 HIGH | Google Android 输入验证错误漏洞 |
| CVE-2021-30319 | 7.8 HIGH | Google Android 输入验证错误漏洞 |
| CVE-2021-30287 | 7.5 HIGH | 多款Qualcomm产品安全漏洞 |
| CVE-2021-30300 | 7.5 HIGH | 多款Qualcomm产品代码问题漏洞 |
| CVE-2021-30301 | 7.5 HIGH | Qualcomm 芯片资源管理错误漏洞 |
| CVE-2021-30307 | 7.5 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30330 | 7.5 HIGH | 多款Qualcomm产品代码问题漏洞 |
| CVE-2021-30353 | 7.5 HIGH | 多款Qualcomm产品安全漏洞 |
| CVE-2021-30313 | 6.7 MEDIUM | 多款Qualcomm产品资源管理错误漏洞 |
IV. Related Vulnerabilities
V. Comments for CVE-2021-30314
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