CVE-2021-35097
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款芯片存在数据伪造问题漏洞，该漏洞源于签名验证调用中的签名验证和哈希顺序不正确。本地攻击者利用该漏洞可破坏目标系统。
Possible ATT&CK Techniques 1 AI
T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-35097
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible authentication bypass due to improper order of signature verification and hashing in the signature verification call in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:C/C:H/I:H/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片数据伪造问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款芯片存在数据伪造问题漏洞，该漏洞源于签名验证调用中的签名验证和哈希顺序不正确。本地攻击者利用该漏洞可破坏目标系统。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | AQT1000, AR8031, AR8035, CSRA6620, CSRA6640, CSRB31024, MDM9150, QCA6174A, QCA6175A, QCA6310, QCA6335, QCA6390, QCA6391, QCA6420, QCA6421, QCA6426, QCA6430, QCA6431, QCA6436, QCA6564, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595, QCA6595AU, | - |
|
II. Public POCs for CVE-2021-35097
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2021-35097 (1)
-
https://www.qualcomm.com/company/product-security/bulletins/august-2022-bulletin x_refsource_CONFIRM
Same Patch Batch · Qualcomm, Inc. · 2022-09-02 · 30 CVEs total
| CVE-2022-22096 | 9.8 CRITICAL | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-35122 | 9.3 CRITICAL | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2022-25680 | 8.4 HIGH | Qualcomm Multimedia 安全漏洞 |
| CVE-2021-35132 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-35134 | 8.4 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2022-22059 | 8.4 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22080 | 8.4 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22097 | 8.4 HIGH | Qualcomm 芯片资源管理错误漏洞 |
| CVE-2022-22098 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22099 | 8.4 HIGH | Qualcomm Multimedia 输入验证错误漏洞 |
| CVE-2022-22100 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22104 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2022-22102 | 8.4 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2022-22106 | 8.4 HIGH | Qualcomm Multimedia 安全漏洞 |
| CVE-2022-22062 | 8.2 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22070 | 7.8 HIGH | Google Pixel 缓冲区错误漏洞 |
| CVE-2022-22061 | 7.8 HIGH | Google Pixel 安全漏洞 |
| CVE-2022-22069 | 7.7 HIGH | Google Pixel 安全漏洞 |
| CVE-2022-22067 | 7.5 HIGH | Google Pixel 安全漏洞 |
| CVE-2022-25657 | 7.3 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
Showing top 20 of 30 CVEs. View all on vendor page → →
IV. Related Vulnerabilities
V. Comments for CVE-2021-35097
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