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I. Basic Information for CVE-2023-28588
Vulnerability Information
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Vulnerability Title
Integer Overflow or Wraparound in Bluetooth Host
Source: NVD (National Vulnerability Database)
Vulnerability Description
Transient DOS in Bluetooth Host while rfc slot allocation.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
整数溢出或超界折返
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于 Bluetooth Host中的整数溢出或环绕。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon APQ8017 -
II. Public POCs for CVE-2023-28588
#POC DescriptionSource LinkShenlong Link
1Nonehttps://github.com/uthrasri/CVE-2023-28588POC Details
2Nonehttps://github.com/Trinadh465/CVE-2023-28588POC Details
3system_bt_CVE-2023-28588https://github.com/uthrasri/CVE-2023-28588_system_btPOC Details
4Nonehttps://github.com/uthrasri/CVE-2023-28588_SinglefilePOC Details
5Nonehttps://github.com/uthrasri/G2.5_CVE-2023-28588POC Details
6Nonehttps://github.com/uthrasri/CVE-2023-28588_G2.5_singlefilePOC Details
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III. Intelligence Information for CVE-2023-28588
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-190
V. Comments for CVE-2023-28588

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