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I. Basic Information for CVE-2023-33107
Vulnerability Information
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Vulnerability Title
Integer Overflow or Wraparound in Graphics Linux
Source: NVD (National Vulnerability Database)
Vulnerability Description
Memory corruption in Graphics Linux while assigning shared virtual memory region during IOCTL call.
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
整数溢出或超界折返
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Chipsets 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Chipsets是美国高通（Qualcomm）公司的一系列芯片组。 Qualcomm Chipsets 存在安全漏洞，该漏洞源于 Graphics Linux 中存在整数溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon 315 5G IoT Modem -
II. Public POCs for CVE-2023-33107
#POC DescriptionSource LinkShenlong Link
1full exploit codehttps://github.com/keto0422/CVE-2023-33107POC Details
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III. Intelligence Information for CVE-2023-33107
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IV. Related Vulnerabilities
Same product: Snapdragon
Same vendor: Qualcomm, Inc.
Same weakness: CWE-190
V. Comments for CVE-2023-33107

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