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I. Basic Information for CVE-2018-11982
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
In Snapdragon (Mobile, Wear) in version MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016, a double free of ASN1 heap memory used for EUTRA CAP container occurs during UTRAN to LTE Capability inquiry procedure.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中存在双重释放漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于移动设备和手表）受到影响：Qualcomm MDM9206；MDM9607；MDM9635M；MDM9640；MDM9645；MDM9655；MSM8909W；MSM8996AU；SD 210；SD 212；SD 205；SD 410/12；SD 425,；
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9645, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 810, SD 820, SD 835, Snapdragon_High_Med_2016 -
II. Public POCs for CVE-2018-11982
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III. Intelligence Information for CVE-2018-11982
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New Vulnerabilities
Product: Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11982

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