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I. Basic Information for CVE-2018-11267
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDX20, Snapdragon_High_Med_2016, when sending an malformed XML data to deviceprogrammer/firehose it may do an out of bounds buffer write allowing a region of memory to be filled with 0x20.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通(Qualcomm)公司应用于不同平台的中央处理器(CPU)产品。 多款Qualcomm Snapdragon产品中的Core存在安全漏洞,该漏洞源于程序没有正确的验证数组索引。攻击者可通过向deviceprogrammer/firehose发送畸形的XML数据利用该漏洞造成缓冲区越界写入。以下产品(用于汽车、移动设备和手表)受到影响:Qualcomm MDM9206;MDM9607;MDM9615;MDM9640;MDM9650;MDM9655;MSM899
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9615, MDM9640, MDM9650, MDM9655, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, -
II. Public POCs for CVE-2018-11267
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III. Intelligence Information for CVE-2018-11267
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IV. Related Vulnerabilities
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