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I. Basic Information for CVE-2018-5837
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, MAC address randomization performed during probe requests is not done properly due to a flawed RNG which produced repeating output much earlier than expected.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品加密问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm IPQ8074等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中存在加密问题漏洞，该漏洞源于程序没有对MAC地址执行正确的随机化操作。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（用于汽车，移动设备或手表）受到影响：Qualcomm IPQ8074；MDM9206；MDM9607；MDM9640；MDM9650；MSM8996AU；QCA6574AU；SD 210；SD 212；SD 2
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear IPQ8074, MDM9206, MDM9607, MDM9640, MDM9650, MSM8996AU, QCA6574AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2 -
II. Public POCs for CVE-2018-5837
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III. Intelligence Information for CVE-2018-5837
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New Vulnerabilities
Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-5837

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