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I. Basic Information for CVE-2018-5874
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
While parsing an mp4 file, a stack-based buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm Snapdragon Automobile、Snapdragon Mobile和Snapdragon Wear 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Snapdragon Automobile、Snapdragon Mobile和Snapdragon Wear都是美国高通（Qualcomm）公司的用于不同平台的中央处理器（CPU）产品。 Qualcomm Snapdragon Automobile、Snapdragon Mobile和Snapdragon Wear中存在基于栈的缓冲区溢出漏洞。攻击者可借助mp4文件利用该漏洞造成拒绝服务或执行任意代码。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20 -
II. Public POCs for CVE-2018-5874
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III. Intelligence Information for CVE-2018-5874
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New Vulnerabilities
Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-5874

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