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I. Basic Information for CVE-2018-5875
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
While parsing an mp4 file, an integer overflow leading to a buffer overflow can occur in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的产品。MDM9206是一款中央处理器（CPU）产品。MDM9607是一款中央处理器（CPU）产品。MDM9650是一款中央处理器（CPU）产品。 多款Qualcomm产品中的Video存在缓冲区错误漏洞。远程攻击者可借助特制文件利用该漏洞在系统上执行代码。以下产品及版本受到影响：MDM9206；MDM9607；MDM9650；MSM8909W；MSM8996AU；SD 210；SD 212；SD 205；SD 425；SD 430；S
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 430, SD 450, SD 600, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SDX20 -
II. Public POCs for CVE-2018-5875
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III. Intelligence Information for CVE-2018-5875
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New Vulnerabilities
Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-5875

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