Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 多款 Qualcomm 产品中存在代码问题漏洞,该漏洞源于产品调试寄存器中的trap处理不当。攻击者可通过该漏洞导致拒绝服务。 由于用户应用程序调试寄存器trap处理不当可能导致拒绝服务。受影响的产品和版本有:QCA6391、QCM6490、QCS6490、QRB5165、QRB5165N、SD778G、SD888 5G、SM7325P、WCD93
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| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile | QCA6391, QCM6490, QCS6490, QRB5165, QRB5165N, SD778G, SD888 5G, SM7325P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WSA8830, WSA8835 | - |
|
| # | POC Description | Source Link | Shenlong Link |
|---|
No public POC found.
Login to generate AI POC| CVE-2021-30351 | 9.8 CRITICAL | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-30276 | 9.3 CRITICAL | Qualcomm 芯片安全漏洞 |
| CVE-2021-30275 | 9.3 CRITICAL | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-30274 | 8.4 HIGH | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2021-30335 | 8.4 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30336 | 8.4 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30282 | 8.4 HIGH | Qualcomm 芯片输入验证错误漏洞 |
| CVE-2021-30337 | 8.4 HIGH | Qualcomm 芯片资源管理错误漏洞 |
| CVE-2021-30262 | 8.4 HIGH | Qualcomm Chipsets 资源管理错误漏洞 |
| CVE-2021-30268 | 7.8 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30279 | 7.8 HIGH | Qualcomm SDX55和QCA6390 访问控制错误漏洞 |
| CVE-2021-30267 | 7.8 HIGH | 多款Qualcomm产品输入验证错误漏洞 |
| CVE-2021-30289 | 7.8 HIGH | 多款Qualcomm产品缓冲区错误漏洞 |
| CVE-2021-30303 | 7.8 HIGH | Qualcomm 芯片缓冲区错误漏洞 |
| CVE-2021-30273 | 7.5 HIGH | Qualcomm 芯片安全漏洞 |
| CVE-2021-30293 | 7.5 HIGH | Qualcomm 芯片信息泄露漏洞 |
| CVE-2021-30271 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30272 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30270 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
| CVE-2021-30269 | 7.3 HIGH | Qualcomm 芯片代码问题漏洞 |
Showing top 20 of 28 CVEs. View all on vendor page → →
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