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CVE-2021-30295

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在缓冲区错误漏洞，该漏洞源于在本地存储当前任务信息时，由于局部变量验证不当可能导致堆溢出。

CVSS 8.4 · High EPSS 0.16% · P6

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-30295

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible heap overflow due to improper validation of local variable while storing current task information locally in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片 缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 芯片存在缓冲区错误漏洞，该漏洞源于在本地存储当前任务信息时，由于局部变量验证不当可能导致堆溢出。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables APQ8017, APQ8053, AQT1000, AR8031, CSRA6620, CSRA6640, CSRB31024, FSM10055, FSM10056, MDM9150, MSM8917, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6584AU, QCA6595, QCA6595AU, QCA6696, QCA937 -

II. Public POCs for CVE-2021-30295

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III. Intelligence Information for CVE-2021-30295

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Other References for CVE-2021-30295 (1)

Same Patch Batch · Qualcomm, Inc. · 2021-09-09 · 20 CVEs total

CVE-2021-1933 9.8 CRITICAL Qualcomm 芯片 输入验证错误漏洞
CVE-2021-1946 9.8 CRITICAL Qualcomm 芯片 代码问题漏洞
CVE-2021-30290 8.4 HIGH Qualcomm 芯片 代码问题漏洞
CVE-2021-30294 8.4 HIGH Qualcomm 芯片 代码问题漏洞
CVE-2021-1934 8.4 HIGH Qualcomm 芯片 资源管理错误漏洞
CVE-2021-1952 7.8 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-1974 7.5 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-1971 7.5 HIGH Qualcomm 芯片 处理逻辑错误漏洞
CVE-2021-1941 7.5 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-1948 7.5 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-1909 7.3 HIGH Qualcomm 芯片 缓冲区错误漏洞
CVE-2021-1935 7.1 HIGH Qualcomm 芯片 代码问题漏洞
CVE-2021-1958 6.7 MEDIUM Qualcomm 芯片资源管理错误漏洞
CVE-2021-1961 6.7 MEDIUM Qualcomm 芯片缓冲区错误漏洞
CVE-2021-1962 6.7 MEDIUM Qualcomm 芯片安全漏洞
CVE-2021-1963 6.7 MEDIUM Qualcomm 芯片 资源管理错误漏洞
CVE-2021-1956 6.5 MEDIUM Qualcomm 芯片 安全漏洞
CVE-2021-1957 6.5 MEDIUM Qualcomm 芯片 安全漏洞
CVE-2021-1960 6.5 MEDIUM Qualcomm 芯片输入验证错误漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-30295

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