Goal Reached Thanks to every supporter — we hit 100%!

Goal: 1000 CNY · Raised: 1336 CNY

100%

CVE-2021-35109

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm多款产品存在输入验证错误漏洞,该漏洞源于对 Core 中用户提供的输入验证不充分。本地攻击者利用该漏洞可破坏目标系统。

CVSS 6.8 · Medium EPSS 0.19% · P9

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
Get alerts for future matching vulnerabilities Log in to subscribe

I. Basic Information for CVE-2021-35109

Vulnerability Information

Have questions about the vulnerability? See if Shenlong's analysis helps!
View Shenlong Deep Dive ↗

Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.

Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible address manipulation from APP-NS while APP-S is configuring an RG where it tries to merge the address ranges in Snapdragon Connectivity, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:P/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm多款产品存在输入验证错误漏洞,该漏洞源于对 Core 中用户提供的输入验证不充分。本地攻击者利用该漏洞可破坏目标系统。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Mobile SD 8 Gen1 5G, SM7450, SM8475, SM8475P, WCD9370, WCD9375, WCD9380, WCD9385, WCN6750, WCN6855, WCN6856, WCN7851, WSA8830, WSA8832, WSA8835 -

II. Public POCs for CVE-2021-35109

# POC Description Source Link Shenlong Link
AI-Generated POC Premium

No public POC found.

Login to generate AI POC

III. Intelligence Information for CVE-2021-35109

登录查看更多情报信息。

Other References for CVE-2021-35109 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-09-02 · 30 CVEs total

CVE-2022-22096 9.8 CRITICAL Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35122 9.3 CRITICAL Qualcomm 芯片输入验证错误漏洞
CVE-2022-25680 8.4 HIGH Qualcomm Multimedia 安全漏洞
CVE-2021-35132 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35134 8.4 HIGH Qualcomm 芯片安全漏洞
CVE-2022-22059 8.4 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22080 8.4 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22097 8.4 HIGH Qualcomm 芯片资源管理错误漏洞
CVE-2022-22098 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2022-22099 8.4 HIGH Qualcomm Multimedia 输入验证错误漏洞
CVE-2022-22104 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2022-22102 8.4 HIGH Qualcomm 芯片代码问题漏洞
CVE-2022-22106 8.4 HIGH Qualcomm Multimedia 安全漏洞
CVE-2022-22100 8.4 HIGH Qualcomm 芯片缓冲区错误漏洞
CVE-2022-22062 8.2 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22070 7.8 HIGH Google Pixel 缓冲区错误漏洞
CVE-2022-22061 7.8 HIGH Google Pixel 安全漏洞
CVE-2022-22069 7.7 HIGH Google Pixel 安全漏洞
CVE-2022-22067 7.5 HIGH Google Pixel 安全漏洞
CVE-2022-25657 7.3 HIGH Qualcomm 芯片缓冲区错误漏洞

Showing top 20 of 30 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

V. Comments for CVE-2021-35109

No comments yet


Leave a comment