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I. Basic Information for CVE-2021-35116
Vulnerability Information

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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通(Qualcomm)公司的芯片。一种将电路(主要包括半导体设备,也包括被动组件等)小型化的方式,并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在输入验证错误漏洞,该漏洞源于 APK 可以将精心制作的模型加载到 CDSP 中,这可能导致 CDSP 和其他在那里执行的 APK 数据受到损害。以下产品和版本受到影响:APQ8009, APQ8009W, APQ8096AU, AQT1000, CSRB31024, MDM9607, MDM9626, MDM9628等
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables APQ8009, APQ8009W, APQ8096AU, AQT1000, CSRB31024, MDM9607, MDM9626, MDM9628, MDM9640, MSM8909W, MSM8937, MSM8996AU, PM8937, QCA6174A, QCA6310, QCA6320, QCA6390, QCA6391, QCA6420, QCA6430, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA66 -
II. Public POCs for CVE-2021-35116
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III. Intelligence Information for CVE-2021-35116
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IV. Related Vulnerabilities
V. Comments for CVE-2021-35116

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