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CVE-2021-35116

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在输入验证错误漏洞，该漏洞源于 APK 可以将精心制作的模型加载到 CDSP 中，这可能导致 CDSP 和其他在那里执行的 APK 数据受到损害。以下产品和版本受到影响：APQ8009, APQ8009W, APQ8096AU, AQT1000, CSRB31024, MDM9607, MDM9626, MDM9628等

CVSS 7.7 · High EPSS 0.16% · P6

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-35116

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
APK can load a crafted model into the CDSP which can lead to a compromise of CDSP and other APK`s data executing there in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:N
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在输入验证错误漏洞，该漏洞源于 APK 可以将精心制作的模型加载到 CDSP 中，这可能导致 CDSP 和其他在那里执行的 APK 数据受到损害。以下产品和版本受到影响：APQ8009, APQ8009W, APQ8096AU, AQT1000, CSRB31024, MDM9607, MDM9626, MDM9628等
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables APQ8009, APQ8009W, APQ8096AU, AQT1000, CSRB31024, MDM9607, MDM9626, MDM9628, MDM9640, MSM8909W, MSM8937, MSM8996AU, PM8937, QCA6174A, QCA6310, QCA6320, QCA6390, QCA6391, QCA6420, QCA6430, QCA6564A, QCA6564AU, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA66 -

II. Public POCs for CVE-2021-35116

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III. Intelligence Information for CVE-2021-35116

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Other References for CVE-2021-35116 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-06-14 · 68 CVEs total

CVE-2022-25651 9.8 CRITICAL Qualcomm 芯片输入验证错误漏洞
CVE-2021-35081 9.8 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-30341 9.8 CRITICAL 多款Qualcomm产品缓冲区错误漏洞
CVE-2021-35104 9.8 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-35090 9.3 CRITICAL Qualcomm 安全漏洞
CVE-2021-35082 9.1 CRITICAL Qualcomm多款产品 安全漏洞
CVE-2021-30342 9.1 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-30343 9.1 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-30347 9.1 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-30339 9.0 CRITICAL 多款Qualcomm芯片安全漏洞
CVE-2021-35123 8.8 HIGH 多款Qualcomm产品安全漏洞
CVE-2021-30281 8.4 HIGH 多款Qualcomm产品访问控制错误漏洞
CVE-2021-30334 8.4 HIGH 多款Qualcomm产品资源管理错误漏洞
CVE-2022-22071 8.4 HIGH Qualcomm多款产品 资源管理错误漏洞
CVE-2022-22068 8.4 HIGH 多款Qualcomm产品资源管理错误漏洞
CVE-2021-30350 8.4 HIGH 多款Qualcomm 芯片缓冲区错误漏洞
CVE-2021-35112 8.4 HIGH 多款Qualcomm产品访问控制错误漏洞
CVE-2021-35114 8.4 HIGH Qualcomm 缓冲区错误漏洞
CVE-2021-35126 8.4 HIGH 多款Qualcomm产品输入验证错误漏洞
CVE-2021-35095 8.4 HIGH Qualcomm 芯片 代码问题漏洞

Showing top 20 of 68 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-35116

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