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CVE-2022-22087

CVSS 7.3 · High EPSS 0.57% · P44
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I. Basic Information for CVE-2022-22087

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
memory corruption in video due to buffer overflow while parsing mkv clip with no codechecker in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:L/I:L/A:L
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm多款产品存在缓冲区错误漏洞，该漏洞源于在没有代码检查器的情况下解析 mkv 剪辑时Video中出现边界错误。远程攻击者利用该漏洞触发内存损坏并在目标系统上执行任意代码。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables APQ8009, APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, AR8031, CSRA6620, CSRA6640, MDM9206, MDM9250, MDM9607, MDM9626, MDM9628, MDM9650, MSM8909W, MSM8917, MSM8937, MSM8953, MSM8996AU, PM8937, QCA4020, QCA6174A, QCA6310, QCA6320, QCA6335, QCA6390, QCA63 -

II. Public POCs for CVE-2022-22087

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III. Intelligence Information for CVE-2022-22087

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Other References for CVE-2022-22087 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-06-14 · 68 CVEs total

CVE-2022-256519.8 CRITICALQualcomm 芯片输入验证错误漏洞
CVE-2021-350819.8 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303419.8 CRITICAL多款Qualcomm产品缓冲区错误漏洞
CVE-2021-351049.8 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-350909.3 CRITICALQualcomm 安全漏洞
CVE-2021-350829.1 CRITICALQualcomm多款产品 安全漏洞
CVE-2021-303429.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303439.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303479.1 CRITICAL多款Qualcomm产品安全漏洞
CVE-2021-303399.0 CRITICAL多款Qualcomm芯片安全漏洞
CVE-2021-351238.8 HIGH多款Qualcomm产品安全漏洞
CVE-2021-302818.4 HIGH多款Qualcomm产品访问控制错误漏洞
CVE-2021-303348.4 HIGH多款Qualcomm产品资源管理错误漏洞
CVE-2022-220718.4 HIGHQualcomm多款产品 资源管理错误漏洞
CVE-2022-220688.4 HIGH多款Qualcomm产品资源管理错误漏洞
CVE-2021-303508.4 HIGH多款Qualcomm 芯片缓冲区错误漏洞
CVE-2021-351128.4 HIGH多款Qualcomm产品访问控制错误漏洞
CVE-2021-351148.4 HIGHQualcomm 缓冲区错误漏洞
CVE-2021-351268.4 HIGH多款Qualcomm产品输入验证错误漏洞
CVE-2021-350958.4 HIGHQualcomm 芯片 代码问题漏洞

Showing top 20 of 68 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2022-22087

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