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I. Basic Information for CVE-2018-11259
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Due to Improper Access Control of NAND-based EFS in Snapdragon Automobile, Snapdragon Mobile and Snapdragon Wear, From fastboot on a NAND-based device, the EFS partition can be erased. Apps processor then has non-secure world full read/write access to the partition until the modem boots and configures the EFS partition addresses in its MPU partition.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm产品访问控制错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司的产品。MDM9206是一款中央处理器（CPU）产品。MDM9607是一款中央处理器（CPU）产品。MDM9640是一款中央处理器（CPU）产品。 多款Qualcomm产品中的NAND-based EFS存在访问控制错误漏洞。攻击者可借助特制请求利用该漏洞获取EFS分区的读、写权限。以下产品受到影响：Qualcomm MDM9206；MDM9607；MDM9635M；MDM9640；MDM9650；MDM9655；MSM8909W；MS
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9635M, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 617, SD 625, SD 650/52, SD 800, SD 810, SD 820, SD 820A, SD 835, SD 845, SD 850, SDM6 -
II. Public POCs for CVE-2018-11259
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III. Intelligence Information for CVE-2018-11259
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New Vulnerabilities
Product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11259

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