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CVE-2022-22057

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Exploitation
Public or AI PoC available; prioritize validation
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在竞争条件问题漏洞，该漏洞源于Graphics 中存在释放后重用漏洞。以下产品及版本受到影响：APQ8053, AR8035, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6595AU, QCA8081, QCA8337, QCA9377, QCM2

CVSS 8.4 · High EPSS 0.43% · P36

Possible ATT&CK Techniques 1 AI

T1203 · Exploitation for Client Execution
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I. Basic Information for CVE-2022-22057

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Use after free in graphics fence due to a race condition while closing fence file descriptor and destroy graphics timeline simultaneously in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 芯片 竞争条件问题漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在竞争条件问题漏洞，该漏洞源于Graphics 中存在释放后重用漏洞。以下产品及版本受到影响：APQ8053, AR8035, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6595AU, QCA8081, QCA8337, QCA9377, QCM2
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables APQ8053, AR8035, MSM8953, QCA6174A, QCA6390, QCA6391, QCA6426, QCA6436, QCA6595AU, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, QRB5165, QRB5165M, QRB5165N, Qualcomm215, SA6155P, SA8155P, SA8195P, SD 8 Gen1 5G, SD439, S -

II. Public POCs for CVE-2022-22057

# POC Description Source Link Shenlong Link
1 None https://github.com/diabl0w/CVE-2022-22057_SM-F926U POC Details
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III. Intelligence Information for CVE-2022-22057

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Exploits & Public PoCs for CVE-2022-22057 (1)

Other References for CVE-2022-22057 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-06-14 · 68 CVEs total

CVE-2021-30341 9.8 CRITICAL 多款Qualcomm产品缓冲区错误漏洞
CVE-2022-25651 9.8 CRITICAL Qualcomm 芯片输入验证错误漏洞
CVE-2021-35104 9.8 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-35081 9.8 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-35090 9.3 CRITICAL Qualcomm 安全漏洞
CVE-2021-30347 9.1 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-30343 9.1 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-30342 9.1 CRITICAL 多款Qualcomm产品安全漏洞
CVE-2021-35082 9.1 CRITICAL Qualcomm多款产品 安全漏洞
CVE-2021-30339 9.0 CRITICAL 多款Qualcomm芯片安全漏洞
CVE-2021-35123 8.8 HIGH 多款Qualcomm产品安全漏洞
CVE-2021-35114 8.4 HIGH Qualcomm 缓冲区错误漏洞
CVE-2021-35095 8.4 HIGH Qualcomm 芯片 代码问题漏洞
CVE-2021-35112 8.4 HIGH 多款Qualcomm产品访问控制错误漏洞
CVE-2021-35091 8.4 HIGH 多款Qualcomm产品代码问题漏洞
CVE-2022-22068 8.4 HIGH 多款Qualcomm产品资源管理错误漏洞
CVE-2022-22071 8.4 HIGH Qualcomm多款产品 资源管理错误漏洞
CVE-2021-30281 8.4 HIGH 多款Qualcomm产品访问控制错误漏洞
CVE-2021-30334 8.4 HIGH 多款Qualcomm产品资源管理错误漏洞
CVE-2021-30350 8.4 HIGH 多款Qualcomm 芯片缓冲区错误漏洞

Showing top 20 of 68 CVEs. View all on vendor page → →

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Wearables
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2022-22057

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