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CVE-2018-11287

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的Video存在安全漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（汽车、移动设备和手表）受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MSM8909W；MSM8996AU；SD 210/SD 212；SD 205；SD 425；SD 427；SD 430；SD 435；SD 450；SD

AI Predicted 7.5 Difficulty: Moderate EPSS 0.94% · P60

Possible ATT&CK Techniques 1 AI

T1055 · Process Injection
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I. Basic Information for CVE-2018-11287

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2016, incorrect control flow implementation in Video while checking buffer sufficiency.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm Snapdragon产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中的Video存在安全漏洞。目前尚无此漏洞的相关信息，请随时关注CNNVD或厂商公告。以下产品（汽车、移动设备和手表）受到影响：Qualcomm MDM9206；MDM9607；MDM9650；MSM8909W；MSM8996AU；SD 210/SD 212；SD 205；SD 425；SD 427；SD 430；SD 435；SD 450；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9650, MSM8909W, MSM8996AU, SD 210/SD 212/SD 205, SD 425, SD 427, SD 430, SD 435, SD 450, SD 625, SD 650/52, SD 820, SD 820A, SD 835, SD 845, SD 850, SDA660, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, SDM710, Snapdragon_High_Med_2 -

II. Public POCs for CVE-2018-11287

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III. Intelligence Information for CVE-2018-11287

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Vendor Advisories for CVE-2018-11287 (1)

Other References for CVE-2018-11287 (1)

Same Patch Batch · Qualcomm, Inc. · 2018-09-20 · 15 CVEs total

CVE-2017-18280 多款Qualcomm Snapdragon产品访问控制错误漏洞
CVE-2017-18302 多款Qualcomm Snapdragon产品安全漏洞
CVE-2017-18314 多款Qualcomm Snapdragon产品访问控制错误漏洞
CVE-2018-11267 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11268 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11269 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11277 多款Qualcomm Snapdragon产品权限许可和访问控制问题漏洞
CVE-2018-11285 多款Qualcomm Snapdragon产品缓冲区错误漏洞
CVE-2018-11290 多款Qualcomm Snapdragon产品加密问题漏洞
CVE-2018-11291 多款Qualcomm Snapdragon产品加密问题漏洞
CVE-2018-11292 多款Qualcomm Snapdragon产品缓冲区错误漏洞
CVE-2018-11982 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-5837 多款Qualcomm Snapdragon产品加密问题漏洞
CVE-2018-5871 多款Qualcomm Snapdragon产品加密问题漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2018-11287

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