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CVE-2018-11292

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm MDM9206等都是美国高通(Qualcomm)公司应用于不同平台的中央处理器(CPU)产品。 多款Qualcomm Snapdragon产品中存在缓冲区溢出漏洞,该漏洞源于WLANWMI命令处理程序没有执行输入验证。攻击者可利用该漏洞造成拒绝服务或执行代码。以下产品(汽车,移动设备和手表)受到影响:Qualcomm MDM9206;MDM9607;MDM9640;MDM9650;MSM8909W;MSM8996AU;QCA6574AU;QCA6584;SD 210;SD 212;SD

AI Predicted 7.5 Difficulty: Moderate EPSS 0.30% · P22

Possible ATT&CK Techniques 1 AI

T1210 · Exploitation of Remote Services
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I. Basic Information for CVE-2018-11292

Vulnerability Information

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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
Source: CVE Program / CVE List V5
CVSS Information
N/A
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
多款Qualcomm Snapdragon产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通(Qualcomm)公司应用于不同平台的中央处理器(CPU)产品。 多款Qualcomm Snapdragon产品中存在缓冲区溢出漏洞,该漏洞源于WLANWMI命令处理程序没有执行输入验证。攻击者可利用该漏洞造成拒绝服务或执行代码。以下产品(汽车,移动设备和手表)受到影响:Qualcomm MDM9206;MDM9607;MDM9640;MDM9650;MSM8909W;MSM8996AU;QCA6574AU;QCA6584;SD 210;SD 212;SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_ -

II. Public POCs for CVE-2018-11292

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III. Intelligence Information for CVE-2018-11292

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Vendor Advisories for CVE-2018-11292 (1)

Other References for CVE-2018-11292 (2)

Same Patch Batch · Qualcomm, Inc. · 2018-09-20 · 15 CVEs total

CVE-2017-18280 多款Qualcomm Snapdragon产品访问控制错误漏洞
CVE-2017-18302 多款Qualcomm Snapdragon产品安全漏洞
CVE-2017-18314 多款Qualcomm Snapdragon产品访问控制错误漏洞
CVE-2018-11267 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11268 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11269 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11277 多款Qualcomm Snapdragon产品权限许可和访问控制问题漏洞
CVE-2018-11285 多款Qualcomm Snapdragon产品缓冲区错误漏洞
CVE-2018-11287 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-11290 多款Qualcomm Snapdragon产品加密问题漏洞
CVE-2018-11291 多款Qualcomm Snapdragon产品加密问题漏洞
CVE-2018-11982 多款Qualcomm Snapdragon产品安全漏洞
CVE-2018-5837 多款Qualcomm Snapdragon产品加密问题漏洞
CVE-2018-5871 多款Qualcomm Snapdragon产品加密问题漏洞

IV. Related Vulnerabilities

V. Comments for CVE-2018-11292

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