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I. Basic Information for CVE-2018-11292
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
In Snapdragon (Automobile, Mobile, Wear) in version MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_High_Med_2016, lack of input validation in WLANWMI command handlers can lead to integer & heap overflows.
Source: NVD (National Vulnerability Database)
CVSS Information
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
多款Qualcomm Snapdragon产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm MDM9206等都是美国高通（Qualcomm）公司应用于不同平台的中央处理器（CPU）产品。 多款Qualcomm Snapdragon产品中存在缓冲区溢出漏洞，该漏洞源于WLANWMI命令处理程序没有执行输入验证。攻击者可利用该漏洞造成拒绝服务或执行代码。以下产品（汽车，移动设备和手表）受到影响：Qualcomm MDM9206；MDM9607；MDM9640；MDM9650；MSM8909W；MSM8996AU；QCA6574AU；QCA6584；SD 210；SD 212；SD
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear MDM9206, MDM9607, MDM9640, MDM9650, MSM8909W, MSM8996AU, QCA6574AU, QCA6584, SD 210/SD 212/SD 205, SD 410/12, SD 425, SD 427, SD 430, SD 435, SD 450, SD 615/16/SD 415, SD 625, SD 650/52, SD 820A, SDM429, SDM439, SDM630, SDM632, SDM636, SDM660, Snapdragon_ -
II. Public POCs for CVE-2018-11292
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III. Intelligence Information for CVE-2018-11292
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IV. Related Vulnerabilities
Same product: Snapdragon Automobile, Snapdragon Mobile, Snapdragon Wear
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2018-11292

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