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I. Basic Information for CVE-2021-30309
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 多款产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Qca 芯片等都是美国高通（Qualcomm）公司的产品。Qualcomm Qca 芯片是一种蓝牙模块芯片。Qualcomm Sd 芯片是一款处理器。Qualcomm Wcd 芯片是一款 Aqstic™ 音频编解码器。 Qualcomm 多款产品存在安全漏洞，该漏洞源于QXDM 命令的大小验证不当会导致内存损坏。受影响的产品和版本如下:MDM9650, QCA6174A, QCA6390, QCA6391, QCA9377, QCM6125, QCS410, QCS603, QCS605
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile MDM9650, QCA6174A, QCA6390, QCA6391, QCA9377, QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SD660, SD665, SD690 5G, SD730, SD765, SD765G, SD768G, SD865 5G, SD870, SDX12, SDX55M, SDXR1, SM7250P, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD -
II. Public POCs for CVE-2021-30309
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III. Intelligence Information for CVE-2021-30309
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IV. Related Vulnerabilities
Same product: Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30309

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