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I. Basic Information for CVE-2021-35077
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 多款产品资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在资源管理错误漏洞，该漏洞源于在计算卸载到 DSP 的免费场景后可能使用，同时多个调用产生一个动态过程。以下产品和版本受影响:AR8035, QCA6174A, QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile AR8035, QCA6174A, QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, QRB5165, QRB5165M, QRB5165N, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA819 -
II. Public POCs for CVE-2021-35077
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III. Intelligence Information for CVE-2021-35077
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35077

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