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I. Basic Information for CVE-2021-30324
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible out of bound write due to lack of boundary check for the maximum size of buffer when sending a DCI packet to remote process in Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:H/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 多款产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Qca 芯片等都是美国高通（Qualcomm）公司的产品。Qualcomm Qca 芯片是一种蓝牙模块芯片。Qualcomm Qcs 芯片是一款高性能的物联网系统级芯片。Qualcomm Wcd 芯片是一款 Aqstic™ 音频编解码器。 Qualcomm 多款产品存在安全漏洞，该漏洞源于在向远程进程发送 DCI 数据包时缺少对缓冲区最大大小的边界检查，可能会出现越界写入。以下产品和版本受到影响:APQ8096AU, AR8031, AR8035, AR9380, CSR8811, CS
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking APQ8096AU, AR8031, AR8035, AR9380, CSR8811, CSRA6620, CSRA6640, IPQ4018, IPQ4019, IPQ4028, IPQ4029, IPQ5010, IPQ5018, IPQ5028, IPQ6000, IPQ6010, IPQ6018, IPQ6028, IPQ8064, IPQ8065, IPQ8068, IPQ8070, IPQ8070A, IPQ8071, IPQ8071A, IPQ8072, IPQ8072A, IPQ8074, -
II. Public POCs for CVE-2021-30324
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III. Intelligence Information for CVE-2021-30324
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables, Snapdragon Wired Infrastructure and Networking
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-30324

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