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CVE-2021-30309

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm Qca 芯片等都是美国高通（Qualcomm）公司的产品。Qualcomm Qca 芯片是一种蓝牙模块芯片。Qualcomm Sd 芯片是一款处理器。Qualcomm Wcd 芯片是一款 Aqstic™ 音频编解码器。 Qualcomm 多款产品存在安全漏洞，该漏洞源于QXDM 命令的大小验证不当会导致内存损坏。受影响的产品和版本如下:MDM9650, QCA6174A, QCA6390, QCA6391, QCA9377, QCM6125, QCS410, QCS603, QCS605

CVSS 7.8 · High EPSS 0.14% · P4

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-30309

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Improper size validation of QXDM commands can lead to memory corruption in Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 多款产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm Qca 芯片等都是美国高通（Qualcomm）公司的产品。Qualcomm Qca 芯片是一种蓝牙模块芯片。Qualcomm Sd 芯片是一款处理器。Qualcomm Wcd 芯片是一款 Aqstic™ 音频编解码器。 Qualcomm 多款产品存在安全漏洞，该漏洞源于QXDM 命令的大小验证不当会导致内存损坏。受影响的产品和版本如下:MDM9650, QCA6174A, QCA6390, QCA6391, QCA9377, QCM6125, QCS410, QCS603, QCS605
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile MDM9650, QCA6174A, QCA6390, QCA6391, QCA9377, QCM6125, QCS410, QCS603, QCS605, QCS610, QCS6125, SD660, SD665, SD690 5G, SD730, SD765, SD765G, SD768G, SD865 5G, SD870, SDX12, SDX55M, SDXR1, SM7250P, WCD9326, WCD9335, WCD9341, WCD9370, WCD9375, WCD9380, WCD -

II. Public POCs for CVE-2021-30309

# POC Description Source Link Shenlong Link
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III. Intelligence Information for CVE-2021-30309

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Other References for CVE-2021-30309 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-02-11 · 13 CVEs total

CVE-2021-30317 9.3 CRITICAL Qualcomm 多款产品授权问题漏洞
CVE-2021-35077 8.4 HIGH Qualcomm 多款产品资源管理错误漏洞
CVE-2021-35075 8.4 HIGH Qualcomm 多款产品代码问题漏洞
CVE-2021-35074 8.4 HIGH Qualcomm 多款产品输入验证错误漏洞
CVE-2021-35068 8.4 HIGH Qualcomm 多款产品代码问题漏洞
CVE-2021-30318 8.4 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-35069 7.8 HIGH Qualcomm 多款产品输入验证错误漏洞
CVE-2021-30323 7.8 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30322 7.8 HIGH Qualcomm 多款产品缓冲区错误漏洞
CVE-2021-30326 7.5 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30325 6.7 MEDIUM Qualcomm 多款产品输入验证错误漏洞
CVE-2021-30324 6.7 MEDIUM Qualcomm 多款产品安全漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-30309

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