Qualcomm Qca 芯片等都是美国高通(Qualcomm)公司的产品。Qualcomm Qca 芯片是一种蓝牙模块芯片。Qualcomm Qcs 芯片是一款高性能的物联网系统级芯片。Qualcomm Sd 芯片是一款处理器。 Qualcomm 多款产品存在安全漏洞,该漏洞源于对 EFS 文件的最大数据写入大小验证不当会导致内存损坏。受影响的产品和版本如下:APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, CSRB31024, MDM8207, MDM91
Although we use advanced large model technology, its output may still contain inaccurate or outdated information.Shenlong tries to ensure data accuracy, but please verify and judge based on the actual situation.
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile, Snapdragon Voice & Music, Snapdragon Wearables | APQ8009W, APQ8017, APQ8053, APQ8096AU, AQT1000, CSRB31024, MDM8207, MDM9150, MDM9205, MDM9206, MDM9207, MDM9250, MDM9607, MDM9628, MDM9640, MDM9650, MDM9655, MSM8909W, MSM8953, MSM8996AU, QCA4004, QCA6174A, QCA6420, QCA6430, QCA6564A, QCA6564AU, QCA6574, | - |
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| # | POC Description | Source Link | Shenlong Link |
|---|
No public POC found.
Login to generate AI POC| CVE-2021-30317 | 9.3 CRITICAL | Qualcomm 多款产品授权问题漏洞 |
| CVE-2021-35077 | 8.4 HIGH | Qualcomm 多款产品资源管理错误漏洞 |
| CVE-2021-35075 | 8.4 HIGH | Qualcomm 多款产品代码问题漏洞 |
| CVE-2021-35074 | 8.4 HIGH | Qualcomm 多款产品输入验证错误漏洞 |
| CVE-2021-35068 | 8.4 HIGH | Qualcomm 多款产品代码问题漏洞 |
| CVE-2021-30318 | 8.4 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-35069 | 7.8 HIGH | Qualcomm 多款产品输入验证错误漏洞 |
| CVE-2021-30322 | 7.8 HIGH | Qualcomm 多款产品缓冲区错误漏洞 |
| CVE-2021-30309 | 7.8 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-30326 | 7.5 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-30325 | 6.7 MEDIUM | Qualcomm 多款产品输入验证错误漏洞 |
| CVE-2021-30324 | 6.7 MEDIUM | Qualcomm 多款产品安全漏洞 |
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