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I. Basic Information for CVE-2021-35074
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Possible integer overflow due to improper fragment datatype while calculating number of fragments in a request message in Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 多款产品输入验证错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在输入验证错误漏洞，该漏洞源于在计算请求消息中的片段数时不正确的片段数据类型可能导致整数溢出。以下产品和版本受到影响：AR8035, QCA6174A, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM6490, QCS6490,
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile AR8035, QCA6174A, QCA6391, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM6490, QCS6490, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA8195P, SD 8 Gen1 5G, SD480, SD888 5G, SDX12, SDX65, SM6375, WCD9335, WCD9370, WCD9375, WCD9380, -
II. Public POCs for CVE-2021-35074
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III. Intelligence Information for CVE-2021-35074
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IV. Related Vulnerabilities
Same product: Snapdragon Auto, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35074

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