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I. Basic Information for CVE-2021-35111
Vulnerability Information
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Vulnerability Title
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Description
Improper validation of tag id while RRC sending tag id to MAC can lead to TOCTOU race condition in Snapdragon Connectivity, Snapdragon Mobile
Source: NVD (National Vulnerability Database)
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: NVD (National Vulnerability Database)
Vulnerability Type
N/A
Source: NVD (National Vulnerability Database)
Vulnerability Title
Qualcomm 安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于 RRC 在调制解调器中向 MAC 发送标签 ID 时未正确验证标签 ID。远程攻击者利用该漏洞可执行拒绝服务（DoS）攻击。
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
VendorProductAffected VersionsCPESubscribe
Qualcomm, Inc.Snapdragon Connectivity, Snapdragon Mobile AR8035, QCA6390, QCA6391, QCA8081, QCA8337, SD 8 Gen1 5G, SD765, SD765G, SD768G, SD778G, SD865 5G, SD870, SD888 5G, SDX55, SDX55M, SDX65, SM7250P, SM7450, SM8475, SM8475P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3991, WCN3998, WCN6750, WCN6850, WC -
II. Public POCs for CVE-2021-35111
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III. Intelligence Information for CVE-2021-35111
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IV. Related Vulnerabilities
Same product: Snapdragon Connectivity, Snapdragon Mobile
Same vendor: Qualcomm, Inc.
V. Comments for CVE-2021-35111

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