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CVE-2021-30322

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞，该漏洞源于对内部参数数组中配置的 GPIO 数量的验证不当，可能会出现越界写入。受影响的产品和版本:AQT1000, AR8035, CSRB31024, FSM10055, FSM10056, MDM9150, MDM9250, MDM9650, MDM9655, QCA6174A, QCA6390,

CVSS 7.8 · High EPSS 0.15% · P5

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-30322

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible out of bounds write due to improper validation of number of GPIOs configured in an internal parameters array in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:L/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 多款产品缓冲区错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在缓冲区错误漏洞，该漏洞源于对内部参数数组中配置的 GPIO 数量的验证不当，可能会出现越界写入。受影响的产品和版本:AQT1000, AR8035, CSRB31024, FSM10055, FSM10056, MDM9150, MDM9250, MDM9650, MDM9655, QCA6174A, QCA6390,
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile AQT1000, AR8035, CSRB31024, FSM10055, FSM10056, MDM9150, MDM9250, MDM9650, MDM9655, QCA6174A, QCA6390, QCA6391, QCA6420, QCA6426, QCA6430, QCA6436, QCA6564A, QCA6564AU, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM6125, QCM6490, -

II. Public POCs for CVE-2021-30322

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III. Intelligence Information for CVE-2021-30322

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Other References for CVE-2021-30322 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-02-11 · 13 CVEs total

CVE-2021-30317 9.3 CRITICAL Qualcomm 多款产品授权问题漏洞
CVE-2021-35077 8.4 HIGH Qualcomm 多款产品资源管理错误漏洞
CVE-2021-35075 8.4 HIGH Qualcomm 多款产品代码问题漏洞
CVE-2021-35074 8.4 HIGH Qualcomm 多款产品输入验证错误漏洞
CVE-2021-35068 8.4 HIGH Qualcomm 多款产品代码问题漏洞
CVE-2021-30318 8.4 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-35069 7.8 HIGH Qualcomm 多款产品输入验证错误漏洞
CVE-2021-30323 7.8 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30309 7.8 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30326 7.5 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30325 6.7 MEDIUM Qualcomm 多款产品输入验证错误漏洞
CVE-2021-30324 6.7 MEDIUM Qualcomm 多款产品安全漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Consumer IOT, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-30322

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