CVE-2021-35077
Quick assessment
Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在资源管理错误漏洞，该漏洞源于在计算卸载到 DSP 的免费场景后可能使用，同时多个调用产生一个动态过程。以下产品和版本受影响:AR8035, QCA6174A, QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA
Possible ATT&CK Techniques 1 AI
T1203 · Exploitation for Client Execution
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I. Basic Information for CVE-2021-35077
Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible use after free scenario in compute offloads to DSP while multiple calls spawn a dynamic process in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:L/AC:L/PR:N/UI:N/S:U/C:H/I:H/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 多款产品资源管理错误漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在资源管理错误漏洞，该漏洞源于在计算卸载到 DSP 的免费场景后可能使用，同时多个调用产生一个动态过程。以下产品和版本受影响:AR8035, QCA6174A, QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)
Affected Products
| Vendor | Product | Affected Versions | CPE | Subscribe |
|---|---|---|---|---|
| Qualcomm, Inc. | Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile | AR8035, QCA6174A, QCA6390, QCA6391, QCA6574, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCA9377, QCM2290, QCM4290, QCM6490, QCS2290, QCS4290, QCS6490, QRB5165, QRB5165M, QRB5165N, SA6145P, SA6150P, SA6155P, SA8145P, SA8150P, SA8155P, SA819 | - |
|
II. Public POCs for CVE-2021-35077
| # | POC Description | Source Link | Shenlong Link |
|---|
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Other References for CVE-2021-35077 (1)
Same Patch Batch · Qualcomm, Inc. · 2022-02-11 · 13 CVEs total
| CVE-2021-30317 | 9.3 CRITICAL | Qualcomm 多款产品授权问题漏洞 |
| CVE-2021-35075 | 8.4 HIGH | Qualcomm 多款产品代码问题漏洞 |
| CVE-2021-35074 | 8.4 HIGH | Qualcomm 多款产品输入验证错误漏洞 |
| CVE-2021-35068 | 8.4 HIGH | Qualcomm 多款产品代码问题漏洞 |
| CVE-2021-30318 | 8.4 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-35069 | 7.8 HIGH | Qualcomm 多款产品输入验证错误漏洞 |
| CVE-2021-30323 | 7.8 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-30322 | 7.8 HIGH | Qualcomm 多款产品缓冲区错误漏洞 |
| CVE-2021-30309 | 7.8 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-30326 | 7.5 HIGH | Qualcomm 多款产品安全漏洞 |
| CVE-2021-30325 | 6.7 MEDIUM | Qualcomm 多款产品输入验证错误漏洞 |
| CVE-2021-30324 | 6.7 MEDIUM | Qualcomm 多款产品安全漏洞 |
IV. Related Vulnerabilities
V. Comments for CVE-2021-35077
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