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CVE-2021-30326

Quick assessment

Affected
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Exploitation
No confirmed in-the-wild exploitation; assess based on exposure
Recommended action
Check the vendor advisory and references for a fixed version. If immediate upgrade is impossible, restrict exposure and increase monitoring.

Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于在处理 RRC Reconfiguration/RRC Setup 消息中的 DownlinkPreemption IE 时不正确的大小验证而可能断言。以下产品和版本受到影响：AR8035, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574A, QCA6574A

CVSS 7.5 · High EPSS 0.57% · P45

Possible ATT&CK Techniques 1 AI

T1190 · Exploit Public-Facing Application
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I. Basic Information for CVE-2021-30326

Vulnerability Information
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Vulnerability Title
N/A
Source: CVE Program / CVE List V5
Vulnerability Description
Possible assertion due to improper size validation while processing the DownlinkPreemption IE in an RRC Reconfiguration/RRC Setup message in Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Source: CVE Program / CVE List V5
CVSS Information
CVSS:3.1/AV:N/AC:L/PR:N/UI:N/S:U/C:N/I:N/A:H
Source: CVE Program / CVE List V5
Vulnerability Type
N/A
Source: CVE Program / CVE List V5
Vulnerability Title
Qualcomm 多款产品安全漏洞
Source: CNNVD (China National Vulnerability Database)
Vulnerability Description
Qualcomm 芯片是美国高通（Qualcomm）公司的芯片。一种将电路（主要包括半导体设备，也包括被动组件等）小型化的方式，并时常制造在半导体晶圆表面上。 Qualcomm 多款产品存在安全漏洞，该漏洞源于在处理 RRC Reconfiguration/RRC Setup 消息中的 DownlinkPreemption IE 时不正确的大小验证而可能断言。以下产品和版本受到影响：AR8035, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574A, QCA6574A
Source: CNNVD (China National Vulnerability Database)
CVSS Information
N/A
Source: CNNVD (China National Vulnerability Database)
Vulnerability Type
N/A
Source: CNNVD (China National Vulnerability Database)

Affected Products

Vendor Product Affected Versions CPE Subscribe
Qualcomm, Inc. Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile AR8035, QCA6390, QCA6391, QCA6426, QCA6436, QCA6574A, QCA6574AU, QCA6595AU, QCA6696, QCA8081, QCA8337, QCM6490, QCS6490, QCX315, SA515M, SD 8 Gen1 5G, SD480, SD690 5G, SD750G, SD765, SD765G, SD768G, SD778G, SD865 5G, SD870, SD888, SD888 5G, SDX55, SDX55M, -

II. Public POCs for CVE-2021-30326

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III. Intelligence Information for CVE-2021-30326

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Other References for CVE-2021-30326 (1)

Same Patch Batch · Qualcomm, Inc. · 2022-02-11 · 13 CVEs total

CVE-2021-30317 9.3 CRITICAL Qualcomm 多款产品授权问题漏洞
CVE-2021-35077 8.4 HIGH Qualcomm 多款产品资源管理错误漏洞
CVE-2021-35075 8.4 HIGH Qualcomm 多款产品代码问题漏洞
CVE-2021-35074 8.4 HIGH Qualcomm 多款产品输入验证错误漏洞
CVE-2021-35068 8.4 HIGH Qualcomm 多款产品代码问题漏洞
CVE-2021-30318 8.4 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-35069 7.8 HIGH Qualcomm 多款产品输入验证错误漏洞
CVE-2021-30323 7.8 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30322 7.8 HIGH Qualcomm 多款产品缓冲区错误漏洞
CVE-2021-30309 7.8 HIGH Qualcomm 多款产品安全漏洞
CVE-2021-30325 6.7 MEDIUM Qualcomm 多款产品输入验证错误漏洞
CVE-2021-30324 6.7 MEDIUM Qualcomm 多款产品安全漏洞

IV. Related Vulnerabilities

Same product: Snapdragon Auto, Snapdragon Compute, Snapdragon Connectivity, Snapdragon Industrial IOT, Snapdragon Mobile
Same vendor: Qualcomm, Inc.

V. Comments for CVE-2021-30326

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